| SMT | Surface Mount Technology |
| TH | Thru-hole Technology |
| Mixed Technology | Both Thru-hole and Surface Mount Technologies |
| Single & Double Sided | Double Sided Surfact Mount and Thru-hole Assembly |
| Sn63 | Eutectic Tin-Lead Solder (63% tin, 37% lead) |
| SAC305 | RoHS Compliant Lead-Free Solder (96.5% tin, 0.5% copper and 3% silver) |
| No Minimum | We are happy to assemble just 1 prototype board if required. |
| No Maximum | Fully capable of assembling up to 10,000 boards in a single production run. |
| Labor Only Production | 4 week standard lead time after receipt of materials from customer. | |
| Turnkey Production | 6-8 weeks standard lead total. | |
| Quick Turn Production | 1 and 2 week turnaround available for production volumes. | |
| Prototype | 48 Hour to 2 Week turns available for prototype runs. |
| Passives | 01005, 0201 and above. |
| Ball Grid Arrays (BGAs) | Includes 100% X-Ray Inspection |
| Fine Pitch | Down to 8 mil pitch. |
| Automated (AOI) | 3D Automated Optical Inspection, Verification of all SMT components. |
| Visual | Visual Inspection using Mantis Microscopes (12x magnification) |
| X-Ray | For BGAs and Leadless Components |
| Functional Testing | Functional Testing and Programming with your Test Fixtures and Procedures |
| Reels | Reels are the most cost effective and dependable packaging for passive components. |
| Tubes & Trays | ICs typically come packaged in Trays or Tubes. |
| Loose Parts | During prototyping loose parts are often unavoidable. We will accept these upon review. |
| Cut Tape | Cut tape is accepted for ICs and passives sized 0603 and larger. |